Clean Plast® CP-H Purge Compound
Available from Clean Plast Purge Compounds
Clean Plast® CP-H and H-EC are a Ready To Use purge in a precise blend of Clean Plast® Highly Concentrated Active and a neutral carrier resin. Clean Plast® will not leave any Purge contamination and since the particle size is 0.1 mm it is safe to mold through the smallest valve gates. There are no abrasives in Clean Plast® CP-H and H-EC purge products. CLEAN PLAST® CP-H and H-EC processing temperature range from 374º F to 608º F (190º C to 320º C). It removes, at the temperature of the previously processed material any hang ups and deposits. Great for Lenses, PA, PC, ABS, SAN, PMMA, and other high temperature resins.